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Heat transfer in solids (Microchip).

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Hello,

I am trying to model (ver 4.3b) a QFN package for ICs that is placed on a PCB and surrounded by a mold compound; where the QFN produces a power of 6 watts and I'd like to investigate how the Temperature is distributed within the mold, PCB, etc...

I am using the 'Heat Transfer in Solids' module, I am setting the QFN as a 'Heat Source' that produces 6 watts and under the 'Heat Transfer in Solids 1' entity, I add all the available domains of the model, except the QFN.

But, I have always an error no matter what mesh or solver I use.

Should I add/change anything in my boundary conditions or try any other solution?

Thank you a lot in advance.

0 Replies Last Post 2014年12月5日 GMT+1 14:38
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