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Convective Cooling of Electronic Components
发布日期 2014
In response to continued miniaturization and increased multi-functionality of electronic circuits, the number of integrated circuit (IC) packages on the circuit board continues to increase. As a consequence the operating power density increases and significant increases in the operating temperature of devices result. To maintain operation and long term performance device temperature must be maintained below specific limits thus necessitating more improved thermal dissipation. In this study, approaches for predicting the performance of vertically oriented plate-fin heat sinks with natural convection have been investigated.
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