论文和技术资料

Laser thermal treatment (LTT) systems have applications in IC fabrication for improving low-k dielectrics properties, polymer curing and resist processing. This contribution deals with a transient model of fast scanning and pulsing laser multi-beam system used in semiconductor processing.

General Heat Transfer application mode formulation with multi-scale modelling approaches are employed. The hope is to predict transient temperature profiles over the semiconductor wafer with uniform processing performance under specific conditions, and to create a flexible simulation tool for process and tool development.