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COMSOL 用户年会 2020 论文和演示
在 2020 年 COMSOL 用户年会上，来自全球的科研人员和工程师展示了他们的多物理场仿真成果。欢迎浏览相关技术论文和演示文稿，了解您所在行业的研究人员当前如何利用数值建模优化产品设计、简化工作流程并改进产品性能。
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ISBN: 978-1-7364524-0-0
Liquid atomization relies on a variety of forces that disturb the surface of the liquid. In the case of flow ...扩展阅读
Simulation of arc-wire additive manufacturing is under development in many academic and industrial sectors ...扩展阅读
The wide bandgap semiconductor silicon carbide (SiC) has drawn increasing attention in recent years as a ...扩展阅读
Introduction: Mechanical ventilation in the ICU can result in complications, including ventilator-induced ...扩展阅读
A tablet blister cavity is thermally modelled using the Shell interface in COMSOL® and a response surface ...扩展阅读
In this paper, the COMSOL Certified Consultant BE CAE & Test shows as the general extrusion operators can ...扩展阅读
In the medical field the risk assessment of strokes caused by pathological irregularities in the carotid ...扩展阅读
The COMSOL® app library of the Technical University of Munich is a collection of applications for simulating ...扩展阅读
Besides the accuracy of the results, the required computation time is an important factor for simulations in ...扩展阅读
The semiconductor industry is always looking for early anticipation of manufacturing risk, pushing the ...扩展阅读